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tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 1 toshiba cmos digital integrated circuit silicon monolithic tmp04090fxxxx(es),jtmp04090xxxxs(es) cmos 4-bit ll microcontroller (otp built-in) (ll: low power consumption & voltage operation microcontroller) the tmp04090fxxxx and jtmp04090xxxxs are high-performance 4-bit microcontrollers incorporating a 16-kword (1 word = 16 bits) one-time prom (otp). they are pin-compatible with the mask rom versions of tmp04ch00fxxx and tmp04ch01fxxx. with programs written to their built-in proms, the devices operate the same as the mask rom products. they are therefore optimal for developing software. with an adapter socket, the tmp04090fxxxx can use a general-purpose eprom programmer for the writing and verification of programs. because the tmp04090fxxxx and jtmp04090xxxxs are developed as software development tools for mask rom versions (tmp04ch00fxxx, tmp04ch01fxxx), they are limited engineering sample versions. for operations other than writing to otp, the devices are the same as the mask rom versions. for these operations, see the data sheets on the tmp04ch00fxxx and tmp04ch01fxxx. note that the otp-version products do not have stop mode and hold mode. do not bring these products to the modes. a malfunction may occur. weight: 1.65 g (typ.)
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 2 features package type device : tmp04090fxxxx (es) chip type device : jtmp04090xxxxs (es) (note) package type device : tmp04090f33f1 (es) chip type device : jtmp0409033f1s (es) (note) parameter otp version corresponding to mask rom version tmp04ch00fxxx (t41) otp version corresponding to mask rom version tmp04ch01fxxx (t42) input pins 8 (in1 to in4, io01 to io04) interrupt: 8 (in1 to in4, io01 to io04) 4 (in1 to in4) interrupt: 4 (in1 to in4) input/output pins 8 (io11 to io14, io21 to io24) interrupt: none 12 (io01 to io04, io11 to io14, io21 to io04) interrupts: 4 (io01 to io04) buzzer output pin 1 drive pattern: 7 1 drive pattern: 6 + 1 v dd fixed type lcd driver controller 60 seg 8 com/58 seg 10 com mask option 52 seg 16 com operating voltage in mcu mode 3.0 v (typ.) 3.0 v (typ.) data ram: 6 kbits data ram: none built-in ram size work ram: 512 4-bit built-in rom size 16 k word (1 word = 16 bits) no. of basic instructions 56 minimum instruction execution time 61 s (32.768 khz) 1 s (2 mhz) oscillator circuit low-speed crystal oscillator (32.768 khz) high-speed crystal oscillator (2 mhz/3.0 v)/external cr (2 mhz/3.0 v) mask option interrupts 2 external (input pin, general-purpose input/output pin) 2 internal (timer/counter, timings) timer 8-bit 2-ch/16-bit 1-ch (selectable by software) watchdog timer timer/counter can be used as watchdog timer prom writing method 8-bit parallel no. of writes 1 (for chip or package type device) note: for product names, see page 14.
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 3 block diagram of tmp04090 (otp version corresponding to mask rom versions, tmp04ch00fxxx and jtmp04ch00xxxs) note: the otp version corresponding to the mask rom versions, tmp04ch01fxxx and jtmp04ch01xxxs (t42), does not include data ram. seg1 to seg60 com1 to com10 v 4 v 3 v 2 v 1 c 1 c 2 v xt v ss v dd bz test xh in xh out xl in xl out breset oscillator control test circuit reset work ram (2 k bits) data ram (6 k bits) interrupt controller timer/counte r (8 bit/16 bit) i/o port (in 8, out 8) display ram lcd controlle r quadrupler voltage reglater bz controller v 1 in1 to in4 io01 to io04 io11 to io14 io21 to io24 t4x core otp writer rom (16 k words)
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 4 pad/pin assignment 1. pad assignment note 1: pin specifications differ between the otp versions corresponding to tmp04ch00fxxx and tmp04ch01fxxx. example: com9/s60, com9 otp version corresponding otp version corresponding to tmp04ch00fxxx to tmp04ch01fxxx note 2: chip size differs from that of the mask rom version. chip size 6.16 5.98 (mm) chip thickness 450 30 ( m) substrate voltage v ss s 50 s 49 s 48 s 47 s 46 s 45 s 44 s 43 s 42 s 41 s 40 s 39 s 38 s 37 s 36 s 35 s 34 s 33 s 32 s 31 s 30 s 29 s 28 s 27 s 26 s 25 s 24 s 23 s 51 s 52 s 53 , com16 s 54 , com15 s 55 , com14 s 56 , com13 s 57 , com12 s 58 , com11 com10/s 59 , com10 com9/s 60 , com9 com8 com7 com6 com5 com4 com3 com2 com1 v 4 v 3 v 2 v 1 c 1 c 2 v ss v x t breset xl in xl ou t v dd xh in xh ou t test bz in1 in2 in3 in4 io01 io02 io03 io04 io11 io12 io13 io14 io21 io22 io23 io24 s 22 s 21 s 20 s 19 s 18 s 17 s 16 s 15 s 14 s 13 s 12 s 11 s 10 s 9 s 8 s 7 s 6 s 5 s 4 s 3 s 2 s 1 jtmp04090xxxxs (top view)
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 5 2. jtmp04090xxxxs (es) pad layout ( 10 3 mm) no. name x point y point no. name x point y point 1 v 1 2901 2505 37 s 8 2901 526 2 c 1 2576 2855 38 s 9 2901 375 3 c 2 2350 2855 39 s 10 2901 225 4 v ss 2141 2855 40 s 11 2901 75 5 v xt 1952 2855 41 s 12 2901 75 6 breset 1764 2855 42 s 13 2901 225 7 xl in 1614 2855 43 s 14 2901 375 8 xl out 1464 2855 44 s 15 2901 525 9 v dd 1314 2855 45 s 16 2901 675 10 xh in 1164 2855 46 s 17 2901 825 11 xh out 1014 2855 47 s 18 2901 975 12 test 596 2855 48 s 19 2901 1126 13 bz 223 2855 49 s 20 2901 1314 14 in1 44 2855 50 s 21 2901 1540 15 in2 106 2855 51 s 22 2901 2505 16 in3 256 2855 52 s 23 2539 2855 17 in4 406 2855 53 s 24 2256 2855 18 io01 557 2855 54 s 25 1992 2855 19 io02 707 2855 55 s 26 1747 2855 20 io03 857 2855 56 s 27 1521 2855 21 io04 1007 2855 57 s 28 1314 2855 22 io11 1157 2855 58 s 29 1126 2855 23 io12 1307 2855 59 s 30 976 2855 24 io13 1457 2855 60 s 31 826 2855 25 io14 1645 2855 61 s 32 675 2855 26 io21 1852 2855 62 s 33 525 2855 27 io22 2078 2855 63 s 34 375 2855 28 io23 2324 2855 64 s 35 225 2855 29 io24 2588 2855 65 s 36 75 2855 30 s 1 2901 2505 66 s 37 75 2855 31 s 2 2901 1540 67 s 38 225 2855 32 s 3 2901 1314 68 s 39 375 2855 33 s 4 2901 1126 69 s 40 525 2855 34 s 5 2901 976 70 s 41 675 2855 35 s 6 2901 826 71 s 42 826 2855 36 s 7 2901 676 72 s 43 976 2855 note: pad x and y point values differ from those of the mask rom version.
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 6 no. name x point y point no. name x point y point 73 s 44 1126 2855 87 s 58 , com11 2901 525 74 s 45 1314 2855 88 com10/s 59 , com10 2901 375 75 s 46 1521 2855 89 com9/s 60 , com9 2901 225 76 s 47 1747 2855 90 com8 2901 75 77 s 48 1992 2855 91 com7 2901 75 78 s 49 2256 2855 92 com6 2901 225 79 s 50 2539 2855 93 com5 2901 375 80 s 51 2901 2505 94 com4 2901 526 81 s 52 2901 1540 95 com3 2901 676 82 s 53 , com16 2901 1314 96 com2 2901 826 83 s 54 , com15 2901 1126 97 com1 2901 976 84 s 55 , com14 2901 975 98 v 4 2901 1126 85 s 56 , com13 2901 825 99 v 3 2901 1314 86 s 57 , com12 2901 675 100 v 2 2901 1540 note: pad x and y point values differ from those of the mask rom version. (supplementary) definition of pad x and y points as shown below, x and y points are determined with the center of the chip as the origin. x point origin y point
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 7 3. pin assignment of tmp04090fxxxx pin no. pin name pin no. pin name pin no. pin name pin no. pin name 1 v 1 26 io21 51 s 22 76 s 47 2 c 1 27 io22 52 s 23 77 s 48 3 c 2 28 io23 53 s 24 78 s 49 4 v ss 29 io24 54 s 25 79 s 50 5 v xt 30 s 1 55 s 26 80 s 51 6 breset 31 s 2 56 s 27 81 s 52 7 xl in 32 s 3 57 s 28 82 s 53 /com16 8 xl out 33 s 4 58 s 29 83 s 54 /com15 9 v dd 34 s 5 59 s 30 84 s 55 /com14 10 xh in 35 s 6 60 s 31 85 s 56 /com13 11 xh out 36 s 7 61 s 32 86 s 57 /com12 12 test 37 s 8 62 s 33 87 s 58 /com11 13 bz 38 s 9 63 s 34 88 s 59 /com10 14 in1 39 s 10 64 s 35 89 s 60 /com9 15 in2 40 s 11 65 s 36 90 com8 16 in3 41 s 12 66 s 37 91 com7 17 in4 42 s 13 67 s 38 92 com6 18 io01 43 s 14 68 s 39 93 com5 19 io02 44 s 15 69 s 40 94 com4 20 io03 45 s 16 70 s 41 95 com3 21 io04 46 s 17 71 s 42 96 com2 22 io11 47 s 18 72 s 43 97 com1 23 io12 48 s 19 73 s 44 98 v 4 24 io13 49 s 20 74 s 45 99 v 3 25 io14 50 s 21 75 s 46 100 v 2 note 1: in the otp version corresponding to tmp04ch00fxxx, pins 82 to 87 are s53 to s58. note 2: in the otp version corresponding to tmp04ch01fxxx, pins 82 to 87 are com16 to com9. 80 tmp04090fxxxx (es) 81 51 100 1 30 50 31
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 8 4. pin description 4.1 pin description of otp version corresponding to tmp04ch00fxxx pin name function v dd power supply v ss gnd v xt voltage regulator1 output v 1 voltage regulator2 output v 2 to v 4 boosted voltage output c 1 to c 2 capacitor pin for lcd booster xh in to xh out crystal/resister connection pin for high speed oscillator xl in to xl out crystal connection pin for low speed oscillator in1 to in4 input port (with interruption) io01 to io04 i/o port (with interruption) io11 to io14 i/o port io21 to io24 i/o port seg1 to seg60 lcd segment output (mask option 58 seg/60 seg selectable) com1 to com10 lcd common output (mask option 10 com/8 com selectable) bz buzzer output breset reset input (low active) test test input (connect to v ss ) 4.2 pin description of otp version corresponding to tmp04ch01fxxx pin name function v dd power supply v ss gnd v xt voltage regulator 1 output v 1 voltage regulator 2 output v 2 to v 4 boosted voltage output c 1 to c 2 capacitor pin for lcd booster xh in to xh out crystal / resister connection pin for high speed oscillator xl in to xl out crystal connection pin for low speed oscillator in1 to in4 input port (with interruption) io01 to io04 i/o port (with interruption) io11 to io14 i/o port io21 to io24 i/o port seg1 to seg52 lcd segment output com1 to com16 lcd common output bz buzzer output breset reset input (low active) test test input (connect to v ss )
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 9 5. operation the tmp04090fxxxx is a one-time prom version of the tmp04ch00fxxx and tmp04ch01fxxx which incorporate mask rom. other than the rom, the configuration and functions of the tmp04090fxxxx are the same as those of the tmp04ch00fxxx and tmp04ch01fxxx. 5.1 operating mode the tmp04090fxxxx supports mcu and prom modes. 5.2 mcu mode fixing the test pin to l level puts the device in mcu mode. in mcu mode, operation is the same as that for the mask rom versions, tmp04ch00fxxx and tmp04ch01fxxx. for the function of mcu mode, refer to the t4x series users' manual. 5.3 prom mode connect a 2-mhz oscillator to the xh in and xh out pins, set the breset pin = v ss and the in1 pin = v dd . then, setting the test pin (v pp ) to h level sets prom mode. definition of the rom area in mcu mode is as shown in figure 1 because 1 word = 16 bits. write to rom in prom mode is performed in 8 bits, divided into two as shown in figure 2. in prom mode, programs can be written or verified using a general-purpose eprom writer. figure 2 addresses in prom mode (0001h) (0003h) ? ? (1fffh) (2001h) ? ? ? (3fffh) (4001h) ? ? ? (5fffh) (6001h) ? ? ? (7fffh) (0000h) (0002h) ? ? (1ffeh) (2000h) ? ? ? (3ffeh) (4000h) ? ? ? (5ffeh) (6000h) ? ? ? (7ffeh) 4 k words 4 k words 4 k words 4 k words page 0 page 1 page 2 page 3 upper 8 bits lower 8 bits figure 1 addresses in mcu mode (0000h) ? ? ? (0fffh) (1000h) ? ? ? (1fffh) (2000h) ? ? ? (2fffh) (3000h) ? ? ? (3fffh) 4 k words 4 k words 4 k words 4 k words page 0 page 1 page 2 page 3 16-bit
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 10 5.4 table of prom mode setting pins listed below are the pins required in prom mode. pin specification pin name no. of pins mcu mode prom mode pin name in prom mode function in prom mode io11 to io14 4 pdb0 to pdb3 io21 to io24 4 input/output input/output pdb4 to pdb7 program memory data input/output (8-bit) s 25 to s 39 15 output input epad0 to epad14 program memory address input (0000h to 7fffh) s 40 1 output input epce (/ce) chip enable signal input s 41 1 output input epoe (/oe) output enable signal input breset 1 input input breset input for setting prom mode (v ss level fixed) in1 1 input input in1 input for setting prom mode (v dd level fixed) test 1 input power supply v pp program voltage input (12.75 v/5 v) xh in 1 high-speed oscillation xh in high-speed oscillation (input) xh out 1 high-speed oscillation xh out high-speed oscillation (output) xl in 1 low-speed oscillation unused unused (v ss level fixed) v dd 1 power supply v cc 5 v supply input (5 v/6.25 v) v 4 1 booster output unused unused (v dd level fixed) v ss 1 gnd gnd 0 v supply input handling of pins not listed above may differ depending on aluminum option. handle by referring to the table below. pin name no. of pins aluminum option code pin specification pin handling a3081 a30a1 with pull-down resistor open a3480 a34a0 without pull-down resistor connect to v ss a5082 a50a2 with pull-down resistor open in2 to in4 3 a33f1 with pull-down resistor open for details of aluminum specifications, see the aluminum specification table.
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 11 5.5 prom mode setting diagram setting the tmp04090fxxxx pins as shown in the figure below sets prom mode. in prom mode, programs can be written or verified using a general-purpose prom writer. since the tmp04090fxxxx does not support an electric signature function, set the prom writer rom type to tc57256ad or equivalent. note: the tmp04090fxxxx can select a high-speed oscillator depending on the mask option, thus the structure of the high-speed oscillator circuit changes according to the mask option specification (figures below). set the oscillator frequency to 2 mhz (typ.) (1) crystal oscillator (2) cr oscillator (supplementary) with package type devices, the pins necessary for setting prom mode are handled on the adapter socket, thus the above setting is unnecessary. xh in xh out 13 k xh in xh out 22 pf 22 pf 2 mhz high-speed oscillator v dd test io11 to io14 io21 to io24 s 25 to s 39 s 40 s 41 xh in xh out xl in v ss in1 v 4 in2 to in4 breset v cc (5 v/6.25 v) v pp (12.75 v/5 v) pdb0 to pdb3 pdb4 to pdb7 epad0 to epad14 epce (/ce) epoe (/oe) general-purpose prom writer v dd connected to v ss depending on aluminum o p tion. tmp04090xxxx
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 12 5.6 how to write using general-purpose prom programmer [1] package type device (tmp04090fxxxx) (1) prepare adapter adapter socket: pn004103 (2) set prom programmer (i) set the prom type to tc57256ad or equivalent. write voltage: 12.75 v (ii) set write address start address: 0000h end address: 7fffh (3) write write or verify a program according to the operation steps of the prom programmer. note 1: for settings, refer to the prom programmer instruction manual. note 2: when installing the mcu on the adapter or installing the adapter on the prom programmer, match pin 1 of the one device to the corresponding pin 1 of the other. if the orientations do not match, the mcu, adapter, or prom programmer will be damaged. note 3: the tmp04090fxxxx does not support electric signature mode (signature). therefore, if signature is used by the prom programmer, 12.5 v 0.5 v is applied to pin 9 of the address (epad9), damaging the device. do not use signature. [2] chip type device (jtmp04090xxxxs) (1) mounting chip type device write program on the chip before mounting peripherals. for how to set prom mode or how to connect to a general-purpose prom writer, see 5.5, prom mode setting diagram. (2) set prom programmer (i) set the prom type to tc57256ad or equivalent. write voltage: 12.75 v (ii) set write address start address: 0000h end address: 7fffh (3) write write or verify a program according to the operation steps of the prom programmer. (supplementary) (1) program memory security (pms), which inhibits reading program after writing, is not supported. (2) gang writer (simultaneous multiple writes) is not supported. (3) program write service is not supported.
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 13 5.7 write flow chart (high-speed program mode ii) with v cc = 6.25 v, applying program voltage of v pp = 12.75 v puts the device in high-speed program mode ii. after entering the address and input data, applying a single program pulse of 0.1 ms to/ce input writes data. verify whether data are written correctly. if not written correctly, apply a 0.1 ms program pulse again. repeat until data are written correctly (up to 25 times). afterwards, change address and input data, and continue writing in the same way. when all writes are complete, set v cc = v pp = 5 v and verify data from all addresses. figure 3 write flow chart in high-speed program mode ii no v cc 6.25 v v cc 5 v v pp 5 v start read from all addresses n 25? v pp 12.75 v set start address n 0 apply 0.1 ms program pulse n n 1 verify last address? end write failure ok ng yes ok yes address address 1 ng no
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 14 6. mask option and pin equivalent circuit 6.1 list of mask option specifications (1) otp version corresponding to tmp04ch00fxxx (t41) input port status product name mask code supply voltage lcd duty no. of segments high- speed oscill- ation low- speed oscill- ation in1 to in4 io01 to io04 io11 to io14 io21 to io24 supply type otp version mask rom version chip type device jtmp040903081s (es) jtmp04ch00xxxs (pi) a3081 3.0 v (typ.) 1/8 60 cr x?tal with pull-down resistor with pull-down resistor package type device tmp04090f3081 (es) tmp04ch00fxxx (bh, d) chip type device jtmp0409030a1s (es) jtmp04ch00xxxs (pi) a30a1 3.0 v (typ.) 1/10 58 cr x?tal with pull-down resistor with pull-down resistor package type device tmp04090f30a1 (es) tmp04ch00fxxx (bh, d) in1 to in4 without pull-down resistor chip type device jtmp040903480s (es) jtmp04ch00xxxs (pi) a3480 3.0 v (typ.) 1/8 60 x?tal x?tal io01 to io04 with pull-down resistor with pull-down resistor package type device tmp04090f3480 (es) tmp04ch00fxxx (bh, d) in1 to in4 without pull-down resistor chip type device jtmp0409034a0s (es) jtmp04ch00xxxs (pi) a34a0 3.0 v (typ.) 1/10 58 x?tal x?tal io01 to io04 with pull-down resistor with pull-down resistor package type device tmp04090f34a0 (es) tmp04ch00fxxx (bh, d) (2) otp version corresponding to tmp04ch01fxxx (t42) input port status product name mask code supply voltage lcd duty no. of segments high- speed oscill- ation low- speed oscill- ation in1 to in4 io01 to io04 io11 to io14 io21 to io24 supply type otp version mask rom version chip type device jtmp0409033f1s (es) jtmp04ch01xxxs (pi) a33f1 3.0 v (typ.) 1/16 52 cr x?tal with pull-down resistor with pull-down resistor package type device tmp04090f33f1 (es) tmp04ch01fxxx (bh, d)
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 15 6.2 input/output circuit for pins (1) control pin shown below is an equivalent circuit of the tmp04090fxxx control pins. control pin input/output circuit remarks high-speed oscillator connection pin (mask option: x?tal) r f 3 m (typ.) xh in xh out input/output external resistor resistor connection pin for high-speed oscillation (mask option: cr) c 10 pf (typ.) xl in xl out input/output low-speed oscillator connection pin (mask option: x?tal) r f 10 m (min) breset input r 1 500 k (typ.) r 2 55.5 k (typ.) r 3 150 (typ.) test (v pp ) input r 1 10 k (typ.) r 2 150 (typ.) bz output cmos output v dd xh in v dd xh out r f osc enable v dd xh in v dd xh out c v dd xl in v dd xl out r f osc, enable v dd r 3 v dd r 1 v dd r 2 test v pp r 2 r 1 test m1 pmode v dd
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 16 (2) input/output ports shown below is an equivalent circuit of the tmp04090fxxx input/output ports. control pin input/output circuit remarks in1 to in4 input pull-down input r 2 400 k (typ.) mask option specified with/without pull-down resistor r 1 150 (typ.) io11 to io14 io21 to io24 input/output key strobe input/output r 2 400 k (typ.) r 1 150 (typ.) io01 to io04 input pull-down input r 2 400 k (typ.) r 1 150 (typ.) note: for the otp version corresponding to the tmp040ch01fxxx (a33f1), io01 to io04 are as shown below control pin input/output circuit remarks io01 to io04 input/output key strobe input/output r 2 400 k (typ.) r 1 150 (typ.) v dd r 1 r 2 v dd r 1 r 2 v dd out v dd r 1 r 2 v dd r 1 r 2 v dd ioo
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 17 7. maximum ratings 7.1 absolute maximum ratings (v ss 0 v, ta 25c 1.5c) (1) tmp04090fxxxx (package type device) characteristics symbol rating unit power supply voltage v dd 0.3 to 6.0 v program supply voltage v pp 0.3 to 13.0 v input voltage v in 0.3 to v dd 0.3 v power dissipation (note) p d 1.0 w solder temperature t sol 260/10 c/s storage temperature t stg 55 to 125 c operating temperature t opr 0 to 40 c note: power dissipation decreases by about 12 mw per 1c. (2) jtmp04090xxxxs (chip type device) characteristics symbol rating unit power supply voltage v dd 0.3 to 6.0 v program supply voltage v pp 0.3 to 13.0 v input voltage v in 0.3 to v dd 0.3 v storage temperature t stg 55 to 125 c operating temperature t opr 0 to 40 c
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 18 8. electrical characteristics 8.1 electrical characteristics in prom mode (1) read operating (t opr 25c 1.5c, v ss 0 v) characteristics symbol pin name test condition min typ. max unit high level v ih1 0.7 v cc v cc input voltage low level v il1 s 25 to s 41 in1 to in4 v ss 0.12 v cc v operating voltage v cc v dd 4.75 5.00 5.25 v program supply voltage v pp test v cc 0.6 v cc v cc 0.6 v read timing diagram note: t cyc 1 s (f xth , f osc2 2 mhz) t cyc 1/f xth 2 clock epad0 to epad14 ce pdb0 to pdb7 oe data output t acc 1.5 tcyc 300 ns (typ.) @v cc 5.0 v
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 19 (2) at program execution (t opr 25c 1.5c v ss 0 v) characteristics symbol applicable pin test condition min typ. max unit high level v ih2 0.7 v cc v cc input voltage low level v il2 io11 to io14 io21 to io24 in1 to in4 s 25 to s 41 v ss 0.12 v cc v operating voltage v cc v dd 6.00 6.25 6.50 v program supply voltage v pp test 12.5 12.75 13.0 v program timing chart note 1: turn supply voltage v pp (12.75 v) on at the same time as or after v cc supply voltage. at power off, turn off at the same time as or before v cc supply voltage. note 2: when v pp 12.75 v 0.25 v, do not insert/remove the device because this will damage the device. that is, do not insert/remove the device while the program is being executed. note 3: the maximum rating of the v pp pin is 13 v. while the program is being executed, including overshoot, make sure that a voltage exceeding 13 v is not applied. epad0 to epad14 ce pdb0 to pdb7 oe input t pw : initial program pulse width 0.1 ms (typ.) @v cc 6.25 v (typ.) v pp 12.75 v (typ.) output unknown t pw write verify initial program v pp
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 20 8.2 electrical characteristic in mcu mode tmp04090fxxxx (es), jtmp04090xxxxs (es) (1) 3.0 v version (unless otherwise specified, v ss 0 v, t opr 0 to 40c) recommended operating condition (t41, t42) characteristics symbol test condition min typ. max unit power supply voltage v dd f xth 2 mhz 2.4 3.0 3.6 v low-speed x?tal f xtl1 v dd 2.4 v to 3.6 v (note 1) 32.768 khz high-speed x?tal f xth1 v dd 2.4 v to 3.6 v (note 2) 2.0 oscillation frequency high-speed cr f xth2 v dd 3.0 v (note 3) 2.0 mhz v dd 2.4 v v dd 0.8 v dd high level v ih v dd 3.6 v v dd 0.7 v dd v dd 2.4 v 0 v dd 0.2 input voltage low level v il v dd 3.6 v 0 v dd 0.3 v quadrupler capacitance c 1 , c 2 0.1 f v 1c 0.1 v 2c 0.1 v 3c 0.1 v 4c 0.1 voltage capacitance v xtc 0.1 f note 1: crystal oscillation circuit is used for low-speed oscillator. note 2: crystal oscillation circuit is used for high-speed oscillator. note 3: an rc oscillating circuit configured with an external r is used for the high-speed oscillator. oscillation (3.0 v version) (t41, t42) characteristics symbol test condition min typ. max unit low-speed x?tal v sta1 t sta 10 s, t opr 25c (note 4) 1.85 osc starting voltage high-speed x?tal v sta2 t sta 8 ms 2.20 v low-speed x?tal v hold1 1.65 osc holding voltage high-speed x?tal v hold2 2.0 v frequency of high-speed osc f osc2 v dd 3.0 v, r f 13.3 k (note 5) 2.0 mhz note 4: internal cr oscillator for low-speed oscillator. note 5: an rc oscillating circuit configured with an external r is used for the high-speed oscillator.
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 21 dc characteristic (3.0 v version) characteristics symbol test condition min typ. max unit i ih1 v dd 3.6 v, v in 0 v 500 500 na input current (1) (in1 to in4, io01 to io04, io11 to io14, io21 to io24) i il1 v dd 3.6 v, v in 3.6 v 6.43 9.0 15.0 a i ih2l v dd 3.6 v, v in 0 v low resistor side 120 72 51.4 input current (2) (breset) i ih2h v dd 3.6 v, v in 0 v high resistor side 12 7.2 5.14 a input current (3) (test) i il3 v dd 3.6 v, v in 3.6 v 10.0 18.0 27.0 a i oh1 v dd 2.4 v, v oh 1.9 v 1.5 ma output current (1) (io11 to io14, io21 to io24) i ol1 v dd 2.4 v, v ol 0.5 v 0.89 1.25 2.08 a i oh2 v dd 2.4 v, v oh 1.9 v 2.0 output current (2) (bz) i ol2 v dd 2.4 v, v ol 0.5 v 2.0 ma i oh3 v oh v 4 0.5 v 100 i ol3 v ol 0.5 v 100 output current (3) (segment) i om3 v dd 3.0 v, v reg 1.125 v, v 2 2.25 v, v 3 3.375 v, v 4 4.5 v v om v 2 0.5 v 50 a i oh4 v oh v 4 0.5 v 100 i ol4 v ol 0.5 v 100 i om4 v om v 3 0.5 v 50 output current (4) (common) i om4 v dd 3.0 v, v reg 1.125 v, v 2 2.25 v, v 3 3.375 v, v 4 4.5 v v om v 1 0.5 v 50 a v reg1 v dd 3.0 v (note 1) 1.075 1.125 1.175 constant output voltage v reg2 v dd 3.0 v (note 2) 1.8 v v 2 2.05 2.25 2.45 v 3 3.175 3.375 3.575 quadrupler output voltage v 4 v dd 3.0 v v reg 1.125 v ta 25c 4.3 4.5 4.7 v note 1: constant output voltage for quadrupler (v1) note 2: constant output for low-speed oscillation circuit (v xt )
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 22 characteristics symbol test condition min typ. max unit display on 1.2 i dd op v dd 3.0 v, f h 2 mhz, f l 32 khz, cpm3 mode display off 1.2 ma display on 30.0 i dd slow v dd 3.0 v, f l 32 khz, f h stop, cpm1 mode display off 29.0 display on 21.0 i dd hold v dd 3.0 v, f l 32 khz, f h stop, halt mode display off 20.0 power supply voltage (1) (high-speed crystal oscillation circuit) (low-speed crystal oscillation circuit) i dd stop v dd 3.0 v, f h stop, f l stop, stop mode 1.2 a display on 1.5 i dd op v dd 3.0 v, f h 2 mhz, f l 32 khz, cpm3 mode display off 1.5 ma display on 33.0 i dd slow v dd 3.0 v, f l 32 khz, f h stop, cpm1 mode display off 32.0 display on 20.0 i dd hold v dd 3.0 v, f l 32 khz, f h stop, halt mode display off 19.0 power supply voltage (2) (high-speed cr oscillation circuit) (low-speed crystal oscillation circuit) i dd stop v dd 3.0 v, f h stop, f l stop, stop mode 1.2 a
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 23 tmp04090fxxxx, tmp04090xxxxs example of application circuit (high-speed crystal oscillation) note 1: recommended high-speed oscillator circuit capacitor: 22 pf (high-speed crystal) note 2: recommended low-speed oscillator circuit capacitor: 15 pf note 3: a 0.1- f capacitor is connected between breset and v ss . (note1) (note 2) (note 3) in 1 in 2 in 3 in 4 io 01 io 02 io 03 io 04 io 11 io 12 io 13 io 14 io 21 io 22 io 23 io 24 xh in xh out xl in xl out breset v ss v dd bz v 4 v 3 v 2 v 1 v xt c 1 c 2 test lcd tmp04090fxxxx, jtmp04090xxxxs seg1 to seg60/com1 to com8 (seg1 to seg58/com1 to com10) (seg1 to seg52/com1 to com16) piezoelectoric buzzer
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 24 package dimensions weight: 1.65 g (typ.)
tmp04090fxxxx(es),jtmp04090xxxxs(es) 2002-12-04 25 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. the products described in this document are subject to the foreign exchange and foreign trade laws. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eb a restrictions on product use

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